Izibonisi ze-LED eziguquguqukayo, njengobuchwepheshe bokubonisa obulandelayo-zisetshenziswa kakhulu ekubonisweni kwezentengiso, imidlalo yasesiteji, namadivayisi agqokekayo ngenxa yobuncane bazo, ukuguquguquka, kanye nokungazweli nomthelela. Inqubo yokukhiqiza iyinkimbinkimbi futhi inembile, idinga ukulawulwa okuqinile kuzo zonke izigaba ukuze kuqinisekiswe ikhwalithi nokusebenza komkhiqizo.
Isinyathelo sokuqala sokukhiqiza izibonisi ze-LED eziguquguqukayo ukulungiswa kwezinto ezibonakalayo. Izinto ezibalulekile zifaka i-substrate eguquguqukayo (njenge-polyimide (PI), ama-LED chips, ama-ICs omshayeli, namasekhethi aphrintiwe aguqukayo (FPCs). Ama-substrate aguqukayo adinga ukumelana nokushisa okuphezulu kanye ne-ductility, kuyilapho ama-LED chips ngokuvamile asebenzisa ama-mini noma ama-LED amancane ukuze athuthukise ukunemba kwesibonisi.
Okulandelayo kuza i-chip die bonding kanye ne-wire bonding. I-Die bonder ephezulu{1}enembayo inamathisela ngokunembile i-chip ye-LED ku-substrate eguquguqukayo. I-Eutectic bonding noma i-adhesive bonding eyisiliva ivikela i-chip. Amabhondi entambo-alungile (njengentambo yegolide) axhuma i-chip kumjikelezo womshayeli ukuze aqinisekise ukudluliswa kwesignali okuzinzile.
Lokhu kulandelwa ukuhlanganiswa kwesifunda nokuhlola. I-flexible printed circuit (FPC) iboshelwe kuhlelo lwe-LED kusetshenziswa i-anisotropic conductive adhesive (ACF) yokuxhuma ugesi. Ngemuva kokuhlanganisa, ukuhlolwa kokuqala kokusebenza kukagesi kuyadingeka ukuze kuhlungwe imikhiqizo enesici futhi kugwenywe ukungcola okulandelayo.
I-encapsulation ne-coating yokuzivikela yizinyathelo ezibalulekile. Ama-chips e-LED ambozwe nge-epoxy resin noma i-silicone ukuze kuthuthukiswe isimo sezulu nomthelela wokumelana. Indawo yesibonisi eguquguqukayo iphinde imbozwe ngefilimu evikelayo ye-PI noma i-UV-i-UV{2}eyelaphekayo ukuze kuvinjelwe i-oxidation nokulimala komshini.
Ekugcineni, ukuhlanganiswa kwamamojula nokuhlolwa kokuguga kuyenziwa. Amayunithi e-LED aguquguqukayo asikwa abe amamojula ngamanye futhi avikelwe ku-backsheet eguquguqukayo kusetshenziswa i-crimping noma i-adhesive bonding. Lawa mamojula ahlolwa ukuguga ezingeni lokushisa eliphezulu kanye nomswakama okungenani amahora angu-72 ukuze kuqinisekiswe{3}}ukuzinza kwesikhathi eside.
Ukukhiqizwa kwezibonisi ze-LED eziguquguqukayo kuhlanganisa i-microelectronics, isayensi yezinto zokwakha, kanye nobuchwepheshe bokukhiqiza obunembayo. Ukulungiselela isinyathelo ngasinye senqubo kuthinta ngokuqondile ukuthembeka nekhwalithi yokubonisa yomkhiqizo wokugcina. Ngokuthuthuka kwezobuchwepheshe, izinqubo zokukhiqiza zizoqhubeka zithuthukela ekusebenzeni kahle kakhulu nasekuhlakanipheni okukhulu.